The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Aug. 06, 2020
Applicant:

Rohm Co., Ltd., Kyoto, JP;

Inventors:

Akira Aoki, Kyoto, JP;

Shinsuke Takagimoto, Kyoto, JP;

Masaaki Nakayama, Kyoto, JP;

Assignee:

Rohm Co., Ltd., Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H02M 3/00 (2006.01); H10D 12/00 (2025.01); H10D 84/83 (2025.01);
U.S. Cl.
CPC ...
H01L 23/49562 (2013.01); H01L 21/48 (2013.01); H01L 23/36 (2013.01); H01L 23/49531 (2013.01); H01L 23/49568 (2013.01); H01L 23/49575 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H02M 3/003 (2021.05); H10D 12/411 (2025.01); H10D 84/83 (2025.01);
Abstract

A semiconductor device comprises: a package having a rectangular shape when viewed in plan and including a first side, a second side parallel to the first side, a third side orthogonal to the first side and the second side, and a fourth side parallel to the third side and orthogonal to the first side and the second side; a power supply terminal provided on the first side; a power ground terminal provided on the second side; a switch output terminal provided on the second side; an upper switch connected between the power supply terminal and the switch output terminal; and a lower switchL connected between the switch output terminal and the power ground terminal.


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