The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Oct. 19, 2021
Applicant:
3m Innovative Properties Company, St. Paul, MN (US);
Inventors:
Shujun J. Wang, Woodbury, MN (US);
Robin E. Gorrell, Round Rock, TX (US);
Roger A. Grisle, Woodbury, MN (US);
Richard Y. Liu, Woodbury, MN (US);
Yaoyao Chen, Fremont, CA (US);
Assignee:
3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); C09J 7/40 (2018.01); C09J 121/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); C09J 7/40 (2018.01); C09J 121/00 (2013.01); C09J 2203/326 (2013.01); C09J 2301/122 (2020.08); C09J 2301/312 (2020.08); C09J 2301/408 (2020.08); C09J 2301/50 (2020.08); H01L 2221/6834 (2013.01); H01L 2221/68386 (2013.01);
Abstract
An article includes a substrate having a circuit forming surface and a non-circuit forming surface opposite the circuit forming surface. The article further includes a protective tape borne on the circuit forming surface. The protective tape includes a support layer and a curable adhesive layer borne on a major surface of the support layer. The curable adhesive layer includes a rubber elastomer and a thermal curing agent.