The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

May. 12, 2021
Applicant:

Infineon Technologies Austria Ag, Villach, AT;

Inventors:

Luca Peluso, Villach, AT;

Matthias J. Kasper, Villach, AT;

Kennith K. Leong, Villach, AT;

Gerald Deboy, Klagenfurt, AT;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 30/06 (2006.01); H01F 27/24 (2006.01); H01F 41/04 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01F 30/06 (2013.01); H01F 27/24 (2013.01); H01F 41/04 (2013.01); H01F 41/046 (2013.01); H05K 1/181 (2013.01); H05K 2201/086 (2013.01);
Abstract

According to one configuration, a fabricator fabricates a core of a circuit component to include magnetic permeable material. The fabricator further produces the circuit component to include multiple electrically conductive paths extending through the core of the magnetic permeable material. In one arrangement, the multiple electrically conductive paths include a first electrically conductive path and a second electrically conductive path. The fabricator fabricates the circuit component and, more specifically, the core of the magnetic permeable material to include at least one cutaway portion operative to reduce inductive coupling between the first electrically conductive path and the second electrically conductive path disposed in the core.


Find Patent Forward Citations

Loading…