The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Nov. 23, 2021
Applicant:

Beijing Dream Ink Technologies Co., Ltd., Beijing, CN;

Inventors:

Zhongwei Ren, Beijing, CN;

Zhenlong Men, Beijing, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); B32B 15/08 (2006.01); B32B 27/28 (2006.01);
U.S. Cl.
CPC ...
H01B 1/22 (2013.01); B32B 15/08 (2013.01); B32B 27/28 (2013.01); B32B 27/283 (2013.01); B32B 2250/03 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/202 (2013.01); B32B 2311/00 (2013.01); B32B 2379/08 (2013.01); B32B 2383/00 (2013.01);
Abstract

The present application provides a liquid metal microcapsule, a conductive paste and preparation methods thereof, and an electronic device, and relates to the technical field of new materials. The present application provides a liquid metal microcapsule, including: a liquid metal core, a cohesive layer coating the liquid metal core, and a coating layer coating the cohesive layer. Binding force between the cohesive layer and liquid metal is greater than that between the coating layer and the liquid metal, and binding force between the cohesive layer and the coating layer is greater than that between the coating layer and the liquid metal. According to the technical solution of the present application, stability of the conductive paste containing liquid metal can be improved.


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