The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
May. 16, 2022
Brookhaven Science Associates, Llc, Upton, NY (US);
The Trustees of Columbia University IN the City of New York, New York, NY (US);
Mingzhao Liu, Syosset, NY (US);
Justine E. Haupt, Mattituck, NY (US);
Connie-Rose Mai Deane, Moriches, NY (US);
Oleg Gang, Setauket, NY (US);
The Trustees of Columbia University in the City of New York, New York, NY (US);
United States Department of Energy, Washington, DC (US);
Abstract
An apparatus includes a main body, circuit assembly, lens, and clamping assembly. The main body includes an aperture that receives a wafer configured to receive a sample under study. The main body is configured to support the circuit assembly, which includes illumination sources that emit light of different colors such that total internal reflection is generated in the wafer. The main body is configured to provide support for the lens, and the clamping assembly mechanically coupled to the main body such that the lens is selectively positionable with respect to a camera lens. A microscopy imaging apparatus includes an illumination source, wafer, and charge-coupled device. The illumination source is configured to emit white light such that total internal reflection is generated in the wafer. The sample under study is disposed between the wafer and the charge coupled device, and the charge coupled device is configured to obtain an image of the sample under study upon illumination of the wafer by the illumination source.