The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Jul. 23, 2021
Applicant:

Cuptronic Technology Ltd., Limassol, CY;

Inventors:

Sven Göthe, Bromma, SE;

Björn Atthoff, Uppsala, SE;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 18/20 (2006.01); C08F 2/46 (2006.01); C08F 4/04 (2006.01); C08F 4/34 (2006.01); C08F 220/06 (2006.01); C08F 283/04 (2006.01); C08F 285/00 (2006.01); C08J 7/18 (2006.01); C09D 4/00 (2006.01); C23C 18/16 (2006.01); C23C 18/28 (2006.01); C23C 18/30 (2006.01); C23C 18/38 (2006.01);
U.S. Cl.
CPC ...
C23C 18/2086 (2013.01); C08F 2/46 (2013.01); C08F 4/04 (2013.01); C08F 4/34 (2013.01); C08F 220/06 (2013.01); C08F 283/04 (2013.01); C08F 285/00 (2013.01); C08J 7/18 (2013.01); C09D 4/00 (2013.01); C23C 18/2033 (2013.01); C23C 18/204 (2013.01); C08J 2323/00 (2013.01); C08J 2333/08 (2013.01); C08J 2333/10 (2013.01); C08J 2355/02 (2013.01); C08J 2375/04 (2013.01); C08J 2377/02 (2013.01); C08J 2433/02 (2013.01); C08J 2433/14 (2013.01); C08J 2467/02 (2013.01); C23C 18/1653 (2013.01); C23C 18/28 (2013.01); C23C 18/30 (2013.01); C23C 18/38 (2013.01);
Abstract

There is provided a method for treating a surface comprising heating the object and the object with a solution comprising a thermal initiator and a polymerizable molecule, wherein the polymerizable molecule reacts with the surface and forms a covalent bond and optionally a covalently bound polymer on the surface of the object. Metal ions are bound to the surface to make the surface possible for adding further metal later. Advantages include that complicated geometries can be coated, problems with oxygen inhibition of the initiator is reduced, and surface reaction to form covalent bonds is promoted compared to the bulk polymerization reaction.


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