The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Oct. 03, 2019
Applicant:

C-tec Constellium Technology Center, Voreppe, FR;

Inventor:

Bechir Chehab, Voiron, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/28 (2021.01); B22F 1/00 (2022.01); B22F 10/22 (2021.01); B22F 10/25 (2021.01); B22F 10/64 (2021.01); B22F 12/41 (2021.01); B33Y 40/20 (2020.01); B33Y 70/00 (2020.01); C21D 1/18 (2006.01); C22C 1/04 (2023.01); C22C 21/00 (2006.01); C22F 1/04 (2006.01); B22F 3/24 (2006.01); B33Y 10/00 (2015.01);
U.S. Cl.
CPC ...
C22C 1/0416 (2013.01); B22F 1/00 (2013.01); B22F 10/22 (2021.01); B22F 10/25 (2021.01); B22F 10/28 (2021.01); B22F 10/64 (2021.01); B22F 12/41 (2021.01); B33Y 40/20 (2020.01); B33Y 70/00 (2014.12); C21D 1/18 (2013.01); C22C 21/00 (2013.01); C22C 21/003 (2013.01); C22F 1/04 (2013.01); B22F 2003/248 (2013.01); B22F 2301/052 (2013.01); B22F 2301/205 (2013.01); B22F 2301/35 (2013.01); B22F 2998/10 (2013.01); B33Y 10/00 (2014.12);
Abstract

A process for manufacturing a part comprising a formation of successive metal layers, superimposed on one another, wherein each layer is formed by the deposition of a filler metal, the filler metal being subjected to an input of energy so as to melt and to constitute said layer by solidifying, the process being characterized in that the filler metal is an aluminium alloy comprising the following alloy elements (% by weight): —Fe: 2% to 8%, and preferably 2% to 6%, more preferentially 3% to 5%; —optionally Zr: 0.5% to 2.5% or 0.5% to 2% or 0.7% to 1.5%; —optionally Si: <1%, or even <0.5% or even <0.2% or even <0.05%; —optionally Cu: ≤0.5%, or even <0.2%, or even <0.05%; —optionally Mg: ≤0.2%, preferably ≤0.1%, preferably <0.05%; —optionally other alloy elements<0.1% individually and in total<0.5%; —impurities: <0.05%, or even <0.01% individually, and in total<0.15%; remainder aluminium.


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