The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Dec. 14, 2022
Applicant:

Elite Material Co., Ltd., Taoyuan, TW;

Inventor:

Chih-Wei Lin, Taoyuan, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 79/08 (2006.01); C08G 73/06 (2006.01); C08G 73/12 (2006.01); C08J 5/24 (2006.01);
U.S. Cl.
CPC ...
C08L 79/08 (2013.01); C08G 73/0611 (2013.01); C08G 73/12 (2013.01); C08G 73/121 (2013.01); C08G 73/128 (2013.01); C08J 5/244 (2021.05); C08L 79/085 (2013.01); C08J 2379/08 (2013.01); C08J 2479/08 (2013.01); C08J 2483/04 (2013.01); C08L 2205/025 (2013.01); C08L 2205/03 (2013.01);
Abstract

A resin composition includes a prepolymer which is prepared from a mixture subjected to a prepolymerization reaction, the mixture including 100 parts by weight of a first maleimide resin, 40 to 60 parts by weight of a siloxane compound and 10 to 30 parts by weight of a diamine compound, wherein: the first maleimide resin includes bisphenol A diphenyl ether bismaleimide; the siloxane compound includes a compound of Formula (I), having a molecular weight of 2200 to 2600 g/mol; and the diamine compound includes 4-aminophenyl-4-aminobenzoate. The resin composition may be used to make various articles, such as a varnish, a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including resin compatibility and X-axis coefficient of thermal expansion.


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