The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 05, 2025

Filed:

Jun. 21, 2019
Applicant:

Dow Silicones Corporation, Midland, MI (US);

Inventors:

Debo Hong, Shanghai, CN;

Chong Xing, Shanghai, CN;

Zhiting Liu, Shanghai, CN;

Assignee:

DOW SILICONES CORPORATION, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/44 (2006.01); C08K 3/22 (2006.01); C08K 5/549 (2006.01); C08L 83/10 (2006.01);
U.S. Cl.
CPC ...
C08G 77/44 (2013.01); C08K 5/549 (2013.01); C08L 83/10 (2013.01); C08K 2003/2227 (2013.01);
Abstract

A thermal conductive silicone composition comprises: (A) a liquid organopolysiloxane having at least two silicon atom-bonded alkenyl groups with 2 to 6 carbon atoms per molecule; (B) a thermal conductive filler with an average particle size of from 5 to 50 μm; (C) a thermal conductive filler with an average particle size of at least 0.1 μm and less than 5 μm; and (D) a carbasilatrane derivative. Optionally, the composition further comprises: (E) an organosiloxane having at least one silicon atom-bonded hydrogen atom per molecule; and/or (F) a hydrosilylation reaction catalyst. The composition exhibits excellent storage stability and handleability despite containing a large quantity of a thermal conductive filler to exhibit high thermal conductivity.


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