The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Feb. 04, 2021
Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;
Kukdo Chemical Co., Ltd., Seoul, KR;
Masahiro Soh, Tokyo, JP;
Kazuo Ishihara, Tokyo, JP;
Jin Soo Lee, Seoul, KR;
Chan Ho Park, Seoul, KR;
Joong Hwi Jee, Seoul, KR;
NIPPON STEEL Chemical & Material Co., Ltd., Tokyo, JP;
KUKDO CHEMICAL CO., LTD., Seoul, KR;
Abstract
To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, as well as an active ester resin that provides the epoxy resin composition. An active ester resin having a polyaryloxy unit containing a dicyclopentenyl group and represented by the following formula (1), and a polyarylcarbonyl unit. Here, Rrepresents a hydrocarbon group having 1 to 8 carbon atoms, Rrepresents a hydrogen atom, or formula (1a) or formula (1b), and at least one Ris formula (1a) or formula (1b); and n represents a number of repetitions of 1 to 5.