The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Jun. 05, 2023
Applicant:
Hamilton Sundstrand Corporation, Charlotte, NC (US);
Inventors:
Luke Borkowski, West Hartford, CT (US);
Tahany I. El-Wardany, Vernon, CT (US);
William K. Tredway, Manchester, CT (US);
Colette O. Fennessy, West Hartford, CT (US);
Assignee:
Hamilton Sundstrand Corporation, Charlotte, NC (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/25 (2021.01); B22F 10/00 (2021.01); B22F 10/50 (2021.01); B22F 12/53 (2021.01); B22F 12/58 (2021.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01); B33Y 80/00 (2015.01);
U.S. Cl.
CPC ...
B22F 10/25 (2021.01); B22F 10/00 (2021.01); B22F 12/53 (2021.01); B22F 12/58 (2021.01); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 80/00 (2014.12); B22F 10/50 (2021.01);
Abstract
A complex concentrated alloy (CCA) and/or high entropy alloy (HEA) additive manufacturing nozzle can include a nozzle body defining at least four powder channels. Each powder channel can be configured to be connected to a powder supply of a plurality of powder supplies to receive a powder from the powder supply for ejecting the powder toward a build area to form an additively manufactured article having a CCA and/or an HEA.