The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

Feb. 07, 2023
Applicant:

Lg Electronics Inc., Seoul, KR;

Inventors:

Changseo Park, Seoul, KR;

Kiseong Jeon, Seoul, KR;

Jinhong Park, Seoul, KR;

Hwankuk Yuh, Seoul, KR;

Assignee:

LG ELECTRONICS INC., Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/813 (2025.01); H01L 25/075 (2006.01); H05B 33/10 (2006.01); H05B 33/14 (2006.01); H05B 33/22 (2006.01); H05K 1/11 (2006.01); H10H 20/831 (2025.01); H10H 20/84 (2025.01); H10H 20/857 (2025.01); H10H 20/851 (2025.01);
U.S. Cl.
CPC ...
H10H 20/813 (2025.01); H01L 25/0753 (2013.01); H05B 33/10 (2013.01); H05B 33/14 (2013.01); H05B 33/22 (2013.01); H05K 1/111 (2013.01); H10H 20/8312 (2025.01); H05K 2201/0145 (2013.01); H10H 20/84 (2025.01); H10H 20/8512 (2025.01); H10H 20/857 (2025.01); Y02B 20/40 (2013.01);
Abstract

A display device, including a substrate having a plurality of metal pads; and a plurality of semiconductor light emitting devices electrically connected to the metal pads. A respective semiconductor light emitting device includes an n-type semiconductor layer, an active layer and a p-type semiconductor layer, a conductive electrode on the p-type semiconductor layer; and a passivation layer configured to surround the respective semiconductor light emitting device and including a through hole through which the conductive electrode is exposed. Further, the conductive electrode includes a protruding portion protruding through the through hole of the passivation layer and overlapping outer surfaces of the passivation layer. Also, the protruding portion of the conductive electrode contacts a corresponding metal pad, and a width of the protruding portion of the conductive electrode is greater than a width of the corresponding metal pad.


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