The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

Sep. 28, 2023
Applicant:

Socionext Inc., Kanagawa, JP;

Inventor:

Hidetoshi Tanaka, Yokohama, JP;

Assignee:

SOCIONEXT INC., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 89/60 (2025.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H10D 89/60 (2025.01); H01L 23/5228 (2013.01);
Abstract

In a semiconductor integrated circuit device, first and second interconnects extending in the X direction are formed in a metal interconnect layer. The first and second interconnects are placed on the opposite sides of each resistor element in the X direction and connected to the resistor element. The first interconnect is connected to PAD, and a third interconnect is connected to VSS. In an ESD protection diode, an anode and a cathode are formed alternately in the Y direction. The resistor element and the first and second interconnects overlap the cathode of the ESD protection diode, and the third interconnect overlaps the anode of the ESD protection diode, in planar view.


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