The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

Jun. 28, 2022
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Peihua Ye, Irvine, CA (US);

Guillaume Alexandre Blin, Carlisle, MA (US);

Thomas Obkircher, Santa Ana, CA (US);

Assignee:

Skyworks Solutions, Inc., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 30/67 (2025.01); H03D 7/14 (2006.01);
U.S. Cl.
CPC ...
H10D 30/6755 (2025.01); H03D 7/1441 (2013.01);
Abstract

In some embodiments, a semiconductor chip device can include a semiconductor substrate having a switching circuit with a first node, and a plurality of layers configured to support the semiconductor substrate and to provide electrical connections for the switching circuit between a second node connectable to a location external to the semiconductor chip and the first node. The plurality of layers can include a redistribution layer, and a signal path can be implemented as a part of the redistribution layer. The signal path can have a first end electrically connected to the first node and a second end electrically connected to the second node, and be configured to provide a selected inductance.


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