The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Sep. 01, 2023
Circuit board and method for manufacturing same, and electronic device comprising same circuit board
Applicant:
Stemco Co., Ltd., Cheongju-si, KR;
Inventors:
Sung Jin Lee, Cheongju-si, KR;
Kang Dong Kim, Seoul, KR;
Chang Hoon Han, Sejong, KR;
Chul Ho Yoon, Cheongju-si, KR;
Ho Byung Kim, Cheongju-si, KR;
Hyun Woo Kim, Cheongju-si, KR;
Gun Woo Shin, Cheongju-si, KR;
Assignee:
STEMCO CO., LTD., Cheongju-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/34 (2006.01); H05K 1/18 (2006.01); H05K 3/10 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4644 (2013.01); H05K 1/181 (2013.01); H05K 3/103 (2013.01); H05K 3/3405 (2013.01); H05K 2201/08 (2013.01); H05K 2203/0502 (2013.01);
Abstract
A circuit board including a contact terminal on a side thereof, a method of fabricating the circuit board, and an electronic device including the circuit board are provided. The circuit board includes: a base layer; a wiring layer formed on the base layer; and a terminal section formed at a level corresponding to the wiring layer, on a first surface and a side surface of one end portion of the base layer.