The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Jun. 17, 2021
Applicant:
Lg Innotek Co., Ltd., Seoul, KR;
Inventors:
Assignee:
LG INNOTEK CO., LTD., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/09 (2006.01); B32B 3/02 (2006.01); B32B 3/30 (2006.01); B32B 7/02 (2019.01); B32B 15/04 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); H05K 1/05 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); B32B 3/02 (2013.01); B32B 3/30 (2013.01); B32B 7/02 (2013.01); B32B 15/043 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/20 (2013.01); H05K 1/09 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); B32B 2255/26 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2264/1055 (2020.08); B32B 2264/302 (2020.08); B32B 2307/204 (2013.01); B32B 2307/30 (2013.01); B32B 2307/538 (2013.01); B32B 2457/08 (2013.01);
Abstract
A resin coated copper according to an embodiment includes: an insulating layer including a resin and a filler dispersed in the resin; and a copper foil layer disposed on the insulating layer, wherein the insulating layer has a plurality of pores formed on a surface in contact with the copper foil layer, and the plurality of pores have a width of 200 nm to 350 nm.