The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
May. 04, 2022
Applicant:
Innolux Corporation, Miao-Li County, TW;
Inventors:
Yi-Hung Lin, Miao-Li County, TW;
Chun-Hung Lai, Miao-Li County, TW;
Yeong-E Chen, Miao-Li County, TW;
Chuan-Ming Yeh, Miao-Li County, TW;
Ching-Wei Chen, Miao-Li County, TW;
Assignee:
InnoLux Corporation, Miao-Li County, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 1/0298 (2013.01);
Abstract
A package device is provided and includes a first circuit layer, a first isolation layer, and a first de-warpage layer. The first circuit layer and the first isolation layer are stacked on each other. At least a portion of the first de-warpage layer is disposed between the first circuit layer and the first isolation layer.