The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Mar. 28, 2024
Applicant:
Murata Manufacturing Co., Ltd., Nagaokakyo, JP;
Inventors:
Douglas Jachowski, Santa Cruz, CA (US);
Greg Dyer, Santa Barbara, CA (US);
Assignee:
MURATA MANUFACTURING CO., LTD., Nagaokakyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/56 (2006.01); H03H 3/02 (2006.01); H03H 9/02 (2006.01); H03H 9/13 (2006.01); H03H 9/17 (2006.01);
U.S. Cl.
CPC ...
H03H 9/568 (2013.01); H03H 3/02 (2013.01); H03H 9/02031 (2013.01); H03H 9/02228 (2013.01); H03H 9/132 (2013.01); H03H 9/174 (2013.01); H03H 9/176 (2013.01); H03H 2003/023 (2013.01);
Abstract
Radio frequency filters are disclosed. A bandpass filter is discloses that includes one first bulk acoustic resonator on a first chip including a first piezoelectric layer having an LN-equivalent thickness less than or equal to 535 nm; a second bulk acoustic resonator on a second chip including a second piezoelectric layer having a thickness greater than the LN-equivalent thickness of the piezoelectric layer on the first chip; and a circuit card coupled to the first chip and the second chip and that electrically connects the first chip to the second chip.