The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

Sep. 29, 2021
Applicant:

Lumentum Operations Llc, San Jose, CA (US);

Inventors:

Wei Shi, San Jose, CA (US);

Kevin Wang, Fremont, CA (US);

Hao Huang, San Jose, CA (US);

John Michael Miller, Ottawa, CA;

Siu Kwan Cheung, San Jose, CA (US);

Lijun Zhu, Pleasanton, CA (US);

Assignee:

Lumentum Operations LLC, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/00 (2006.01); H01S 5/02253 (2021.01); H01S 5/02345 (2021.01); H01S 5/0239 (2021.01); H01S 5/024 (2006.01); H01S 5/026 (2006.01); H01S 5/183 (2006.01); H01S 5/42 (2006.01); H01L 23/00 (2006.01); H01S 5/02208 (2021.01); H01S 5/02257 (2021.01); H01S 5/068 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0239 (2021.01); H01S 5/02253 (2021.01); H01S 5/02345 (2021.01); H01S 5/02469 (2013.01); H01S 5/0261 (2013.01); H01S 5/18388 (2013.01); H01S 5/423 (2013.01); H01L 24/00 (2013.01); H01S 5/02208 (2013.01); H01S 5/02257 (2021.01); H01S 5/06825 (2013.01);
Abstract

In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.


Find Patent Forward Citations

Loading…