The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
May. 25, 2021
Applicant:
Furukawa Electric Co., Ltd., Tokyo, JP;
Inventors:
Eisaku Kaji, Tokyo, JP;
Yutaka Ohki, Tokyo, JP;
Assignee:
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/0237 (2021.01); H01S 5/022 (2021.01); H01S 5/023 (2021.01); H01S 5/0239 (2021.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01S 5/0237 (2021.01); H01S 5/022 (2013.01); H01S 5/023 (2021.01); H01S 5/0239 (2021.01); H01S 5/4025 (2013.01);
Abstract
A semiconductor-laser-chip-on-submount includes: a semiconductor laser chip that includes a semiconductor portion having an emitting facet and a rear facet along a longitudinal direction and emits laser light from the emitting facet; and a submount where the semiconductor laser chip is mounted. Further, a first distance between the submount and the emitting facet of the semiconductor portion is less than a second distance between the submount and the rear facet of the semiconductor portion.