The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

Jan. 11, 2023
Applicants:

Sumitomo Wiring Systems, Ltd., Yokkaichi, JP;

Toyota Jidosha Kabushiki Kaisha, Toyota, JP;

Inventors:

Kazuya Takeuchi, Yokkaichi, JP;

Norihito Hashimoto, Yokkaichi, JP;

Kazuya Kobayashi, Yokkaichi, JP;

Shinobu Wakahara, Toyota, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/6581 (2011.01); H01R 13/02 (2006.01); H01R 13/24 (2006.01); H01R 13/40 (2006.01); H01R 13/428 (2006.01); H01R 13/432 (2006.01); H01R 13/502 (2006.01); H01R 12/71 (2011.01); H01R 12/72 (2011.01); H01R 13/22 (2006.01); H01R 13/42 (2006.01); H01R 13/514 (2006.01); H01R 13/516 (2006.01); H01R 13/646 (2011.01); H01R 13/648 (2006.01); H01R 13/658 (2011.01); H01R 13/6585 (2011.01); H01R 13/6594 (2011.01); H01R 107/00 (2006.01);
U.S. Cl.
CPC ...
H01R 13/6581 (2013.01); H01R 13/02 (2013.01); H01R 13/24 (2013.01); H01R 13/2442 (2013.01); H01R 13/245 (2013.01); H01R 13/40 (2013.01); H01R 13/428 (2013.01); H01R 13/432 (2013.01); H01R 13/502 (2013.01); H01R 12/71 (2013.01); H01R 12/712 (2013.01); H01R 12/714 (2013.01); H01R 12/716 (2013.01); H01R 12/724 (2013.01); H01R 13/22 (2013.01); H01R 13/2407 (2013.01); H01R 13/42 (2013.01); H01R 13/514 (2013.01); H01R 13/516 (2013.01); H01R 13/646 (2013.01); H01R 13/648 (2013.01); H01R 13/658 (2013.01); H01R 13/6585 (2013.01); H01R 13/6594 (2013.01); H01R 2107/00 (2013.01);
Abstract

A shield connector includes an inner conductor, an outer conductor, a dielectric, and a housing. The outer conductor includes an outer-conductor-side contact portion that is disposed behind the housing and faces backward in a coupled state with the housing. The housing includes a housing-side contact portion facing forward in the coupled state with the outer conductor. The outer-conductor-side contact portion and the housing-side contact portion contact each other in the coupled state between the outer conductor and the housing.


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