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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12374646 B1

PDFFull Text
Date of Patent:
Jul. 29, 2025

Filed:

Jan. 13, 2022

Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body

Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Norzafriza Nitta, Tokyo, JP;

Hidemichi Fujiwara, Tokyo, JP;

Yoshihiro Sato, Tokyo, JP;

Assignee:

FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;

Attorney:

Oblon, McClelland, Maier & Neustadt, L.L.P.

Primary Examiner:

Julio J Maldonado

Assistant Examiner:

Stanetta D Isaac

Int. Cl.
CPC ...
H01L 23/00 (2006.01); C09J 7/38 (2018.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 101/02 (2006.01); C09J 171/00 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 24/29 (2013.01); C09J 7/385 (2018.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 101/02 (2013.01); C09J 171/00 (2013.01); H01L 21/6836 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); C09J 2401/00 (2013.01); C09J 2409/006 (2013.01); C09J 2423/106 (2013.01); C09J 2433/00 (2013.01); C09J 2467/006 (2013.01); C09J 2471/00 (2013.01); H01L 24/83 (2013.01); H01L 2221/68386 (2013.01); H01L 2224/27003 (2013.01); H01L 2224/271 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/29082 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29311 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29499 (2013.01); H01L 2224/3205 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/8384 (2013.01);
Abstract

A bonding film for bonding a semiconductor element and a substrate. The bonding film has an electroconductive bonding layer formed by molding an electroconductive paste including metal fine particles (P) into a film form, and a tack layer having tackiness and laminated on the electroconductive bonding layer. The tack layer includes 0.1% to 1.0% by mass of metal fine particles (M) with respect to the metal fine particles (P) in the electroconductive bonding layer, and the metal fine particles (M) have a melting point of 250° C. or lower.

Find Patent Forward Citations

Nitta, Norzafriza. (2025). Bonding film, tape for wafer processing, method for producing bonded body, and bonded body and pasted body (U.S. Patent No. 12374646). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12374646

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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