The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Nov. 22, 2021
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventor:
Effendi Leobandung, Stormville, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/30604 (2013.01); H01L 21/308 (2013.01); H01L 21/561 (2013.01); H01L 24/18 (2013.01); H01L 25/0655 (2013.01); H01L 23/3128 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H01L 2223/54486 (2013.01);
Abstract
An aggregate die comprises a substrate, a first sub die, and a second sub die. The substrate comprises a surface with a first set of substrate alignment guides and a second set of substrate alignment guides. The first sub die comprises a first set of sub die alignment guides that interface with the substrate alignment guides in the first set of substrate alignment guides. The second sub die comprises a second set of sub die alignment guides that interface with substrate alignment guides in the second set of substrate alignment guides.