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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12374628 B1

PDFFull Text
Date of Patent:
Jul. 29, 2025

Filed:

Nov. 22, 2021

Processor die alignment guides

Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventor:

Effendi Leobandung, Stormville, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorney:

Kimberly Zillig

Primary Examiner:

Yara B Green

Assistant Examiner:

Victor V Barzykin

Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/306 (2006.01); H01L 21/308 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 21/30604 (2013.01); H01L 21/308 (2013.01); H01L 21/561 (2013.01); H01L 24/18 (2013.01); H01L 25/0655 (2013.01); H01L 23/3128 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54453 (2013.01); H01L 2223/54486 (2013.01);
Abstract

An aggregate die comprises a substrate, a first sub die, and a second sub die. The substrate comprises a surface with a first set of substrate alignment guides and a second set of substrate alignment guides. The first sub die comprises a first set of sub die alignment guides that interface with the substrate alignment guides in the first set of substrate alignment guides. The second sub die comprises a second set of sub die alignment guides that interface with substrate alignment guides in the second set of substrate alignment guides.

Find Patent Forward Citations

Leobandung, Effendi. (2025). Processor die alignment guides (U.S. Patent No. 12374628). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12374628

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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