The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
May. 02, 2022
Huawei Digital Power Technologies Co., Ltd., Shenzhen, CN;
Huawei Digital Power Technologies Co., Ltd., Shenzhen, CN;
Abstract
A packaged power semiconductor device includes a power semiconductor wafer, a heat conduction layer, and a heat sink that are sequentially stacked, and a sealing part configured to wrap and seal the power semiconductor wafer and at least part of the heat conduction layer. The packaged power semiconductor device further includes a pin, where the pin includes a connection segment wrapped inside the sealing part, and an extension segment located outside the sealing part. The connection segment is electrically connected to the power semiconductor wafer, and a shortest distance between the extension segment and a first outer surface is greater than a creepage distance corresponding to a highest working voltage of the power semiconductor wafer. This can avoid a creepage phenomenon of the pin by limiting a distance between the first outer surface and the extension segment that is of the pin and that is exposed outside the sealing part.