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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12374560 B1

PDFFull Text
Date of Patent:
Jul. 29, 2025

Filed:

Oct. 20, 2022

Method for manufacturing electronic device

Applicant:

Innolux Corporation, Miao-Li County, TW;

Inventors:

Chin-Lung Ting, Miao-Li County, TW;

Cheng-Chi Wang, Miao-Li County, TW;

Yu-Jen Chang, Miao-Li County, TW;

Ju-Li Wang, Miao-Li County, TW;

Assignee:

InnoLux Corporation, Miao-Li County, TW;

Attorney:

Winston Hsu

Primary Examiner:

Wojciech Haske

Int. Cl.
CPC ...
H01L 21/48 (2006.01); C23C 14/34 (2006.01); C23C 14/58 (2006.01); C23C 28/00 (2006.01); C23C 28/02 (2006.01); C25D 7/12 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 21/486 (2013.01); C23C 14/34 (2013.01); C23C 14/5873 (2013.01); C23C 28/023 (2013.01); C23C 28/322 (2013.01); C25D 7/123 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 21/6835 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 2221/68345 (2013.01); H01L 2224/11462 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/13021 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16237 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73203 (2013.01);
Abstract

The present disclosure discloses a manufacturing method of an electronic device. A seed layer is formed on a substrate. After patterning the seed layer to form a plurality of sub-seed layers and a plurality of conductive lines, a metal layer is formed on a plurality of the sub-seed layers. The sub-seed layers include a first sub-seed layer and a second sub-seed layer, and the first sub-seed layer and the second sub-seed layer are separated from each other.

Find Patent Forward Citations

Ting, Chin-Lung. (2025). Method for manufacturing electronic device (U.S. Patent No. 12374560). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12374560

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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