logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12371771 B1

PDFFull Text
Date of Patent:
Jul. 29, 2025

Filed:

Jan. 14, 2022

Plated steel

Applicant:

Nippon Steel Corporation, Tokyo, JP;

Inventors:

Takuya Mitsunobu, Tokyo, JP;

Hiroshi Takebayashi, Tokyo, JP;

Takehiro Takahashi, Tokyo, JP;

Assignee:

NIPPON STEEL CORPORATION, Tokyo, JP;

Attorney:

Renner, Otto, Boisselle & Sklar, LLP

Primary Examiner:

Seth Dumbris

Int. Cl.
CPC ...
C23C 2/06 (2006.01); B32B 15/01 (2006.01); C21D 1/74 (2006.01); C21D 1/84 (2006.01); C21D 8/02 (2006.01); C21D 9/46 (2006.01); C22C 21/00 (2006.01); C22C 21/02 (2006.01); C22C 21/10 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); B23K 11/11 (2006.01);
U.S. Cl.
CPC ...
C23C 2/06 (2013.01); B32B 15/011 (2013.01); C21D 1/74 (2013.01); C21D 1/84 (2013.01); C21D 8/0205 (2013.01); C21D 8/0278 (2013.01); C21D 9/46 (2013.01); C22C 21/00 (2013.01); C22C 21/02 (2013.01); C22C 21/10 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); B23K 11/11 (2013.01); C21D 2251/02 (2013.01); C21D 2261/00 (2013.01); Y10T 428/12757 (2015.01);
Abstract

This plated steel includes: a steel; and a plating layer formed on the steel, in which the plating layer contains, as a chemical composition, by mass %, Zn: 1.0% to 30.0%, Mg: 0% to 10.0%, Si: 0.05% to 10.0%, Fe: 0 to 10.0%, 0% to 5.00% in total of one or two or more selected from Ca: 0% to 3.00%, Sb: 0% to 0.50%, Pb: 0% to 0.50%, Sr: 0% to 0.50%, Sn: 0% to 1.00%, Cu: 0% to 1.00%, Ti: 0% to 1.00%, Ni: 0% to 1.00%, Mn: 0% to 1.00%, Cr: 0% to 1.00%, La: 0% to 1.00%, Ce: 0% to 1.00%, Zr: 0% to 1.00%, and Hf: 0% to 1.00%, and a remainder of Al and impurities, a microstructure of the plating layer contains an α phase which is a solid solution of Al and Zn, and the α phase contains a Zn phase having a grain size of 10 to 200 nm in a number density of 10/100 μmor more.

Find Patent Forward Citations

Loading…