The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Mar. 16, 2020
Nippon Steel Corporation, Tokyo, JP;
Seiya Okada, Tokyo, JP;
Hiroki Kamitani, Tokyo, JP;
Nobuaki Komatsubara, Tokyo, JP;
Yusaku Tomio, Tokyo, JP;
Shohei Ikeda, Tokyo, JP;
Naoya Shirasawa, Tokyo, JP;
NIPPON STEEL CORPORATION, Tokyo, JP;
Abstract
The seamless steel pipe according to the present disclosure includes a base material and a decarburized layer formed on the surface of the base material. The chemical composition of the base material consists of, in mass %, C: 0.20 to 0.50%, Si: 0.05 to 0.50%, Mn: 0.01 to 1.00%, P: 0.0300% or less, S: 0.0100% or less, Al: 0.005 to 0.100%, Cr: 0.30 to 1.20%, Mo: 0.30 to 1.50%, Ti: 0.002 to 0.050%, V: 0.01 to 0.30%, Nb: 0.002 to 0.100%, B: 0.0001 to 0.0050%, N: 0.0100% or less, O: 0.0050% or less, and with the balance being Fe and impurities. The base material has a yield strength of 655 MPa or more, and a yield ratio of 85.0% or more. The decarburized layer has a depth of 150 μm or less.