The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 29, 2025

Filed:

Jul. 29, 2024
Applicant:

Labforinvention, Fremont, CA (US);

Inventor:

Guowen Ding, San Jose, CA (US);

Assignee:

Labforinvention, Fremont, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/14 (2006.01); B32B 17/10 (2006.01);
U.S. Cl.
CPC ...
B32B 17/10183 (2013.01); B32B 3/14 (2013.01); B32B 17/10036 (2013.01); B32B 17/10201 (2013.01); B32B 17/1022 (2013.01); B32B 2307/418 (2013.01); B32B 2419/00 (2013.01);
Abstract

Described are energy-efficient signal-transparent window assemblies and methods of fabricating thereof. These assemblies remain IR-blocking properties while allowing signal penetration and remain substantially transparent within the visible spectrum with no features detectable to the naked eye. This performance is achieved by isolating conductive layers into discrete cells via gap patterning. The second coating stack's line widths are at least 0.4 micrometer greater than the gaps among the primary stacks. The thickness of the primary stack increases from zero to full thickness near the gap, with a sidewall transition length exceeding 0.2 micrometers. The fabrication process involves lithography for patterning, PVD coating, and post-clean and high-temperature treatments. In some examples, a transparent organic thin layer is provided between the second coating stack and the primary stack or the substrate. Additionally, a thick dry-photoresist method in a special lithography process could significantly reduce manufacturing cost.


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