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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12370632 B1

PDFFull Text
Date of Patent:
Jul. 29, 2025

Filed:

Oct. 13, 2022

Metal particle for adhesive paste, method of preparing the same, solder paste including the same, composite bonding structure formed therefrom, and semiconductor device including the composite bonding structure

Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Junghoon Lee, Seongnam-si, KR;

Kunmo Chu, Seoul, KR;

Assignee:

Samsung Electronics Co., Ltd., Gyeonggi-do, KR;

Attorney:

HARNESS, DICKEY & PIERCE, P.L.C.

Primary Examiner:

Daniel J Schleis

Int. Cl.
CPC ...
B23K 35/02 (2006.01); B22F 1/17 (2022.01); B23K 35/26 (2006.01); B23K 35/36 (2006.01); B23K 35/368 (2006.01); B23K 101/40 (2006.01); B23K 103/16 (2006.01);
U.S. Cl.
CPC ...
B23K 35/025 (2013.01); B22F 1/17 (2022.01); B23K 35/262 (2013.01); B23K 35/3602 (2013.01); B23K 35/368 (2013.01); B23K 2101/40 (2018.08); B23K 2103/166 (2018.08);
Abstract

Provided is a metal particle for adhesive paste. The metal particle may include a core including at least one metal; and a shell on at least one surface of the core and including at least one metal and nanoparticles. The metal particle may be a transient liquid phase particle and the at least one metal of the core may have a higher melting point than a melting point of the at least one metal of the shell. In addition, provided are a method of preparing the metal particle for adhesive paste, a composite bonding structure formed from the metal particle for adhesive paste, and a semiconductor device including the composite bonding structure.

Find Patent Forward Citations

Lee, Junghoon. (2025). Metal particle for adhesive paste, method of preparing the same, solder paste including the same, composite bonding structure formed therefrom, and semiconductor device including the composite bonding structure (U.S. Patent No. 12370632). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12370632

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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