The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2025
Filed:
Mar. 14, 2024
Honeywell Federal Manufacturing & Technologies, Llc, Kansas City, MO (US);
Ryan John Eickbush, Grandview, MO (US);
Logan Thomas Walz, Belton, MO (US);
Honeywell Federal Manufacturing & Technologies, LLC, Kansas City, MO (US);
Abstract
A method may apply an ink layer in a desired pattern onto a substrate with a substrate coefficient of thermal expansion. A method may heat the ink layer and the substrate at a temperature increase ramp rate to a predefined target temperature for the ink layer, to obtain a metallic layer in substantially the desired pattern and with a metallic coefficient of thermal expansion. A method may cool the metallic layer and the substrate at a temperature decrease ramp rate, wherein a difference between the substrate coefficient of thermal expansion and the metallic coefficient of thermal expansion, in combination with the temperature increase ramp rate and the temperature decrease ramp rate, operates to completely delaminate the metallic layer from the substrate, thereby producing the patterned metallic foil.