The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Sep. 28, 2023
Applicant:
Magic Leap, Inc., Plantation, FL (US);
Inventor:
Kevin Curtis, Boulder, CO (US);
Assignee:
MAGIC LEAP, INC., Plantation, FL (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H10H 20/857 (2025.01); F21V 8/00 (2006.01); G02B 27/01 (2006.01); H10H 20/01 (2025.01); H10H 20/831 (2025.01); H10H 20/852 (2025.01);
U.S. Cl.
CPC ...
H10H 20/857 (2025.01); G02B 6/001 (2013.01); G02B 6/0028 (2013.01); G02B 6/005 (2013.01); G02B 6/0076 (2013.01); G02B 27/017 (2013.01); G02B 27/0172 (2013.01); G02B 2027/0118 (2013.01); G02B 2027/0134 (2013.01); G02B 2027/0178 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/73265 (2013.01); H10H 20/0364 (2025.01); H10H 20/8314 (2025.01); H10H 20/852 (2025.01);
Abstract
In some embodiments, an interconnect electrical connects a light emitter to wiring on a substrate. The interconnect may be deposited by 3D printing and lays flat on the light emitter and substrate. In some embodiments, the interconnect has a generally rectangular or oval cross-sectional profile and extends above the light emitter to a height of about 50 μm or less, or about 35 μm or less. This small height allows close spacing between an overlying optical structure and the light emitter, thereby providing high efficiency in the injection of light from the light emitter into the optical structure, such as a light pipe.