The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Feb. 13, 2024
Applicant:
Epistar Corporation, Hsinchu, TW;
Inventors:
Hao-Min Ku, Hsinchu, TW;
You-Hsien Chang, Hsinchu, TW;
Shih-I Chen, Hsinchu, TW;
Fu-Chun Tsai, Hsinchu, TW;
Hsin-Chih Chiu, Hsinchu, TW;
Assignee:
EPISTAR CORPORATION, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10H 20/01 (2025.01); H01L 21/683 (2006.01); H10H 20/857 (2025.01);
U.S. Cl.
CPC ...
H10H 20/018 (2025.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); H10H 20/01 (2025.01); H01L 2221/68318 (2013.01); H01L 2221/68363 (2013.01); H01L 2221/68381 (2013.01); H10H 20/0364 (2025.01); H10H 20/857 (2025.01);
Abstract
A semiconductor structure includes a substrate, an adhesion layer, arranged on the substrate, a first release layer, arranged on the adhesion layer and a first semiconductor device, including a semiconductor epitaxial stack, and a conducting structure directly connected to the first release layer. The first semiconductor device is not electrically connected to the substrate by the adhesion layer and the first release layer.