The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Oct. 27, 2021
Coretronic Corporation, Hsin-Chu, TW;
Yi-Hsing Peng, Hsin-Chu, TW;
Ching-Tai Tseng, Hsin-Chu, TW;
Coretronic Corporation, Hsin-Chu, TW;
Abstract
A bonding method for an electronic element includes attaching a solder film to a display substrate and covering multiple bonding pads, performing a heat treatment step so that a solder layer on the multiple bonding pads is transformed into multiple solder bumps, providing at least one electronic element and covering the solder bumps, and heating the solder bumps to electrically bond the at least one electronic element and the bonding pads. The display substrate includes multiple display panels, a first adhesive layer, and a glass cover. The first adhesive layer and the glass cover are disposed on one side of the display panel away from the bonding pads. During the bonding process of the at least one electronic element and the bonding pads, no pressure is applied between the at least one electronic element and the bonding pads.