The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Sep. 28, 2021
Applicant:

Fuji Electric Co., Ltd., Kanagawa, JP;

Inventor:

Masanori Inoue, Ina, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/00 (2025.01); H01L 23/00 (2006.01); H10D 62/17 (2025.01);
U.S. Cl.
CPC ...
H10D 62/393 (2025.01); H01L 24/49 (2013.01); H01L 2224/49431 (2013.01);
Abstract

Provided is a semiconductor apparatus comprising: a semiconductor substrate; an element electrode provided above the semiconductor substrate; an element electrode pad electrically connected to the element electrode; and a wire configured to connect to the element electrode pad at a plurality of connection points, wherein the semiconductor substrate includes an emitter region of a first conductivity type arrayed in an array direction, the emitter region facing the element electrode on an upper surface of the semiconductor substrate, wherein a density of the emitter region below a connection point of any of the wires is different from a density of the emitter region below a connection point of any other of the wires.


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