The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Dec. 24, 2020
Applicant:

Tdk Corporation, Tokyo, JP;

Inventors:

Daiki Ishii, Tokyo, JP;

Yoshihiko Yano, Tokyo, JP;

Kenichi Yoshida, Tokyo, JP;

Tetsuhiro Takahashi, Tokyo, JP;

Yuki Yamashita, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01G 2/06 (2006.01); H01G 4/005 (2006.01); H01G 4/008 (2006.01); H01G 4/01 (2006.01); H01G 4/012 (2006.01); H01G 4/06 (2006.01); H01G 4/10 (2006.01); H01G 4/12 (2006.01); H01G 4/228 (2006.01); H01G 4/33 (2006.01); H01L 25/16 (2023.01); H05K 1/18 (2006.01); H10D 1/68 (2025.01); H01G 4/252 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H10D 1/696 (2025.01); H01G 2/065 (2013.01); H01G 4/005 (2013.01); H01G 4/008 (2013.01); H01G 4/01 (2013.01); H01G 4/012 (2013.01); H01G 4/06 (2013.01); H01G 4/10 (2013.01); H01G 4/1209 (2013.01); H01G 4/1218 (2013.01); H01G 4/1254 (2013.01); H01G 4/228 (2013.01); H01G 4/33 (2013.01); H01L 25/16 (2013.01); H05K 1/18 (2013.01); H10D 1/712 (2025.01); H01G 4/252 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/19015 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19102 (2013.01); H01L 2924/19103 (2013.01); H05K 2201/10015 (2013.01);
Abstract

To provide a thin film capacitor in which peeling-off of an electrode layer is less likely to occur. A thin film capacitor includes a metal foil having a roughened upper surface, a dielectric film covering the upper surface of the metal foil and having an opening for partly exposing the metal foil therethrough, a first electrode layer contacting the metal foil through the opening and further contacting the dielectric film, and a second electrode layer contacting the dielectric film without contacting the metal foil. With this configuration, both the first and second electrode layers can be disposed on the upper surface of the metal foil. In addition, the first electrode layer contacts not only the metal foil but also the dielectric film, making peeling of the first electrode layer less likely to occur.


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