The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Nov. 10, 2020
Applicant:
Fuji Corporation, Chiryu, JP;
Inventors:
Kenji Tsukada, Toyota, JP;
Ryojiro Tominaga, Okazaki, JP;
Assignee:
FUJI CORPORATION, Chiryu, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/32 (2006.01); H05K 1/11 (2006.01); H05K 3/00 (2006.01); H05K 3/12 (2006.01); H05K 3/28 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 3/321 (2013.01); H05K 1/111 (2013.01); H05K 3/0014 (2013.01); H05K 3/125 (2013.01); H05K 3/1283 (2013.01); H05K 3/284 (2013.01); H05K 1/181 (2013.01);
Abstract
A circuit forming method including a first wiring forming step of forming a first metal wiring on a resin layer, and a second wiring forming step of forming a second metal wiring on the first metal wiring, in which a Young's modulus of the first metal wiring and a Young's modulus of the second metal wiring are different from each other.