The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Aug. 13, 2021
Circuit fabrication method that includes reconfiguration of via connections between circuit elements
Innovium, Inc., San Jose, CA (US);
Vittal Balasubramanian, San Jose, CA (US);
Yongming Xiong, Fremont, CA (US);
Keith Michael Ring, San Francisco, CA (US);
Innovium, Inc., San Jose, CA (US);
Abstract
In a circuit fabrication method, first, second, and third initial vias are fabricated in a circuit board. First and second conductive traces are fabricated at first and second depths in the circuit board. Either a first indication is obtained that, in a final circuit configuration, an integrated circuit is to be directly electrically connected to a first circuit element without directly electrically connecting to a second circuit element, or a second indication is obtained that, in the final circuit configuration, the integrated circuit is to be directly electrically connected to the second circuit element without directly electrically connecting to the first circuit element. In response to obtaining the first indication, a first portion of the second initial via is removed by drilling. In response to obtaining the second indication, a second portion of the second initial via is removed by drilling.