The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
May. 05, 2023
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Osamu Miki, Nagaokakyo, JP;
Tatsuya Hosotani, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Abstract
A circuit module includes a circuit module substrate having an area smaller than a large-scale circuit board, an electronic circuit component mounted on the circuit module substrate, a connection pin provided to the circuit module substrate, and a circuit-module-substrate-side fitting structure part provided to the circuit module substrate. A pin receptacle and the connection pin are electrically connected to each other. A non-conductive thermal adhesive layer is formed between a surface of the circuit module substrate and a surface of a base material of the large-scale circuit board facing to each other, the non-conductive thermal adhesive layer electrically insulating and thermally joining the surfaces by a non-conductive thermally conductive material.