The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Jun. 21, 2021
Applicant:

Nitto Denko Corporation, Ibaraki, JP;

Inventors:

Tadao Okawa, Ibaraki, JP;

Takashi Oda, Ibaraki, JP;

Masataka Yamaji, Ibaraki, JP;

Kazushi Ichikawa, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); G02B 6/12 (2006.01); G02B 6/42 (2006.01); H05K 1/02 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/117 (2013.01); G02B 6/12 (2013.01); G02B 6/4214 (2013.01); G02B 6/4274 (2013.01); G02B 6/428 (2013.01); H05K 1/0271 (2013.01); H05K 1/144 (2013.01); H05K 2201/041 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/1034 (2013.01);
Abstract

An optical communication module substrate includes a wiring board and an opto-electronic hybrid substrate, the wiring board and the opto-electronic hybrid substrate being connected to each other, in which a connection terminal of the wiring board and a connection terminal of the opto-electronic hybrid substrate are electrical connection points, and a frame-shaped removal portion is formed by removing a portion of the metal reinforcing layer of the opto-electronic hybrid substrate that faces the connection terminal with the insulating layer interposed between the metal reinforcing layer and the connection terminal, so as to surround each terminal. According to this configuration, the connection strength at the connection point between the wiring board and the opto-electronic hybrid substrate is sufficiently ensured, and the optical communication module substrate has excellent electrical properties that are compatible with high-speed signal transmission.


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