The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Feb. 27, 2023
Applicant:
Borgwarner Us Technologies Llc, Wilmington, DE (US);
Inventors:
David Paul Buehler, Noblesville, IN (US);
Kevin M. Gertiser, Carmel, IN (US);
David W. Ihms, Kokomo, IN (US);
Mark Wendell Gose, Kokomo, IN (US);
Assignee:
BorgWarner US Technologies LLC, Wilmington, DE (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); B60L 3/00 (2019.01); B60L 15/00 (2006.01); B60L 15/08 (2006.01); B60L 50/40 (2019.01); B60L 50/51 (2019.01); B60L 50/60 (2019.01); B60L 50/64 (2019.01); B60L 53/20 (2019.01); B60L 53/22 (2019.01); B60L 53/62 (2019.01); B60R 16/02 (2006.01); G01R 15/20 (2006.01); G06F 1/08 (2006.01); G06F 13/40 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 23/00 (2006.01); H01L 23/051 (2006.01); H01L 23/15 (2006.01); H01L 23/20 (2006.01); H01L 23/26 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/40 (2006.01); H01L 23/42 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); H01L 23/492 (2006.01); H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2023.01); H02J 7/00 (2006.01); H02M 1/00 (2006.01); H02M 1/08 (2006.01); H02M 1/084 (2006.01); H02M 1/088 (2006.01); H02M 1/12 (2006.01); H02M 1/32 (2007.01); H02M 1/42 (2007.01); H02M 1/44 (2007.01); H02M 3/335 (2006.01); H02M 7/00 (2006.01); H02M 7/537 (2006.01); H02M 7/5387 (2007.01); H02M 7/5395 (2006.01); H02P 27/06 (2006.01); H02P 27/08 (2006.01); H02P 29/024 (2016.01); H02P 29/68 (2016.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01); H05K 5/02 (2006.01); H05K 7/20 (2006.01); H10D 64/01 (2025.01); B60L 15/20 (2006.01); H03K 19/20 (2006.01);
U.S. Cl.
CPC ...
H02P 27/06 (2013.01); B60L 3/003 (2013.01); B60L 15/007 (2013.01); B60L 15/08 (2013.01); B60L 50/40 (2019.02); B60L 50/51 (2019.02); B60L 50/60 (2019.02); B60L 50/64 (2019.02); B60L 53/20 (2019.02); B60L 53/22 (2019.02); B60L 53/62 (2019.02); B60R 16/02 (2013.01); G01R 15/20 (2013.01); G06F 1/08 (2013.01); G06F 13/4004 (2013.01); H01L 21/4882 (2013.01); H01L 23/15 (2013.01); H01L 23/3672 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/4006 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); H01L 23/49562 (2013.01); H01L 23/5383 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 25/072 (2013.01); H01L 25/50 (2013.01); H02J 7/0063 (2013.01); H02M 1/0009 (2021.05); H02M 1/0054 (2021.05); H02M 1/08 (2013.01); H02M 1/084 (2013.01); H02M 1/088 (2013.01); H02M 1/123 (2021.05); H02M 1/32 (2013.01); H02M 1/322 (2021.05); H02M 1/327 (2021.05); H02M 1/4258 (2013.01); H02M 1/44 (2013.01); H02M 3/33523 (2013.01); H02M 7/003 (2013.01); H02M 7/537 (2013.01); H02M 7/5387 (2013.01); H02M 7/53871 (2013.01); H02M 7/53875 (2013.01); H02M 7/5395 (2013.01); H02P 27/08 (2013.01); H02P 27/085 (2013.01); H02P 29/024 (2013.01); H02P 29/027 (2013.01); H02P 29/68 (2016.02); H05K 1/145 (2013.01); H05K 1/181 (2013.01); H05K 1/182 (2013.01); H05K 5/0247 (2013.01); H05K 7/20154 (2013.01); H05K 7/2039 (2013.01); H05K 7/2049 (2013.01); H05K 7/20854 (2013.01); H05K 7/209 (2013.01); H05K 7/20927 (2013.01); H10D 64/018 (2025.01); B60L 15/20 (2013.01); B60L 2210/30 (2013.01); B60L 2210/40 (2013.01); B60L 2210/42 (2013.01); B60L 2210/44 (2013.01); B60L 2240/36 (2013.01); G06F 2213/40 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/33181 (2013.01); H02J 2207/20 (2020.01); H02P 2207/05 (2013.01); H03K 19/20 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10166 (2013.01);
Abstract
A power module includes: a first substrate having an outer surface and an inner surface, the first substrate extending from a first longitudinal end toward a second longitudinal end; a semiconductor die coupled to the inner surface of the first substrate; and a second substrate having an outer surface and an inner surface, the semiconductor die being coupled to the inner surface of the second substrate, the second substrate extending from a first longitudinal end toward a second longitudinal end, wherein the first longitudinal end of the first substrate is longitudinally offset from the first longitudinal end of the second substrate.