The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

May. 14, 2021
Applicant:

Boe Technology Group Co., Ltd., Beijing, CN;

Inventors:

Zhijun Lv, Beijing, CN;

Feng Zhang, Beijing, CN;

Wenqu Liu, Beijing, CN;

Xiaoxin Song, Beijing, CN;

Zhao Cui, Beijing, CN;

Liwen Dong, Beijing, CN;

Detian Meng, Beijing, CN;

Libo Wang, Beijing, CN;

Dongfei Hou, Beijing, CN;

Lizhen Zhang, Beijing, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2023.01); H01F 7/06 (2006.01); H01F 7/20 (2006.01); H01L 23/00 (2006.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01); H10H 20/01 (2025.01);
U.S. Cl.
CPC ...
H01L 25/167 (2013.01); H01F 7/064 (2013.01); H01F 7/20 (2013.01); H01L 24/05 (2013.01); H01L 24/95 (2013.01); H10D 86/441 (2025.01); H10D 86/60 (2025.01); H10H 20/018 (2025.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/06131 (2013.01); H01L 2224/2957 (2013.01); H01L 2224/29611 (2013.01); H01L 2224/29639 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/95133 (2013.01); H01L 2224/95136 (2013.01);
Abstract

A driving backplane, a transfer method for a light-emitting diode chip (), and a display apparatus. The driving backplane comprises: a base substrate (), a driving circuit, a plurality of electromagnetic structures (), and a plurality of contact electrodes (). The plurality of electromagnetic structures () in the driving backplane are symmetrically arranged relative to a first straight line (L) and a second straight line (L). A current signal can be applied to each electromagnetic structure () by means of the driving circuit. Stress generated by a transfer carrier plate () according to the magnetic force of each electromagnetic structure () moves the transfer carrier plate (). When the transfer carrier plate () is stress balanced in each direction parallel to the surface of the transfer carrier plate (), the light-emitting diode chip () is precisely aligned to corresponding contact electrodes ().


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