The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Jun. 10, 2022
Samsung Electronics Co., Ltd., Suwon-si, KR;
Hyunsu Kim, Cheonan-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
Abstract
A semiconductor package including: a package substrate; a spacer chip attached on a surface of the package substrate, the spacer chip having a groove pattern in a surface of the spacer chip; at least one semiconductor chip mounted on the package substrate, the at least one semiconductor chip being attached on the surface of the spacer chip via an adhesive film; and a sealing member on the surface of the package substrate, the sealing member covering the spacer chip and the at least one semiconductor chip.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile