The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Nov. 29, 2022
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Nobuaki Yamashita, Kanagawa, JP;

Takashi Numagi, Tokyo, JP;

Kunihiko Uchida, Saitama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/00 (2006.01); H10B 80/00 (2023.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5386 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H10B 80/00 (2023.02); H01L 25/18 (2013.01); H01L 2224/14155 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/14361 (2013.01);
Abstract

An electronic module includes a wiring board having a first main surface and a second main surface on a back side of the first main surface, and a first semiconductor element and a second semiconductor element that are mounted on the wiring board. The first semiconductor element includes a first signal terminal and a second signal terminal. The second semiconductor element includes a third signal terminal and a fourth signal terminal. The wiring board includes a first signal line including a first signal trace disposed in a first conductor layer, a second signal line including a second signal trace disposed in a second conductor layer that is closer to the second main surface than the first conductor layer is, a first ground trace disposed in the first conductor layer, and a second ground trace disposed in the second conductor layer.


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