The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

May. 29, 2024
Applicant:

Semiconductor Components Industries, Llc, Scottsdale, AZ (US);

Inventor:

Jesse Emmett Galloway, Chandler, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/38 (2006.01); H01L 23/473 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/4735 (2013.01); H01L 23/38 (2013.01); H01L 23/40 (2013.01);
Abstract

A jet impingement cooling assembly for semiconductor devices includes a heat exchange base having an inlet chamber and an outlet chamber. An inlet connection may be in fluid connection with the inlet chamber, while an outlet connection may be in fluid connection with the outlet chamber. A jet plate may be coupled to the inlet chamber, and a jet pedestal may be formed on the jet plate and having a raised surface with a jet nozzle formed therein.


Find Patent Forward Citations

Galloway, Jesse. (2025). Jet impingement cooling for high power semiconductor devices (U.S. Patent No. 12368088). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12368088

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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