The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
May. 28, 2021
Fuji Electric Co., Ltd., Kawasaki, JP;
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Abstract
A method of manufacturing a semiconductor device, including preparing a semiconductor wafer having a first main surface and a second main surface opposite to each other, forming a first electrode on the first main surface of the semiconductor wafer, applying a first tape to the second main surface of the semiconductor wafer, so as to cover the second main surface of the semiconductor wafer with the first tape, applying a second tape to an outer peripheral portion of the semiconductor wafer, to thereby cover an end of the semiconductor wafer with the second tape, heating the semiconductor wafer having the first tape and the second tape applied thereto, by a heat treatment at a temperature of at least 40 degrees C., and forming a plating layer on a surface of the first electrode after heating the semiconductor wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile