Semiconductor element memory device

Abstract

A memory device includes pages each constituted by a plurality of memory cells arranged in columns on a substrate, voltages applied to a first gate conductor layer, a second gate conductor layer, a first impurity region, and a second impurity region in each memory cell included in each page are controlled to perform a page write operation of retaining a group of positive holes, generated by an impact ionization phenomenon or a gate-induced drain leakage current, inside a semiconductor body, the voltages applied to the first gate conductor layer, the second gate conductor layer, the first impurity region, and the second impurity region are controlled to perform a page erase operation of discharging the group of positive holes from inside the semiconductor body and further lowering a voltage of the semiconductor body with capacitive coupling with the first gate conductor layer and with the second gate conductor layer, and in the page erase operation, at least two or more pages are simultaneously selected from among the pages and the page erase operation is performed.