The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Feb. 18, 2024
Applicant:

Samsung Display Co., Ltd., Yongin-si, KR;

Inventors:

Yanghee Kim, Yongin-si, KR;

Jeongho Lee, Seoul, KR;

Won Ho Kim, Seongnam-si, KR;

Soyeon Park, Seoul, KR;

Dong-Hyun Lee, Suwon-si, KR;

Hyungchul Lim, Cheonan-si, KR;

Assignee:

Samsung Display Co., Ltd., Yongin-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 3/044 (2006.01); H10D 86/01 (2025.01); H10D 86/40 (2025.01); H10D 86/60 (2025.01);
U.S. Cl.
CPC ...
G06F 3/0445 (2019.05); G06F 3/0446 (2019.05); H10D 86/021 (2025.01); H10D 86/441 (2025.01); H10D 86/60 (2025.01); G06F 2203/04103 (2013.01);
Abstract

A method of fabricating an electronic apparatus including the steps of forming a circuit element on a base substrate, forming a signal line on the base substrate, forming a first insulating layer covering the circuit element and the signal line, forming a display device layer including a light-emitting device on the first insulating layer, forming a first conductive layer on the display device layer, forming a second insulating layer covering the first insulating layer and the first conductive layer, forming a first contact hole penetrating the first and second insulating layers in a first region overlapping with the first conductive layer, forming a second contact hole penetrating the first and second insulating layers in a second region overlapping with an end portion of the signal line, forming a second conductive layer overlapping with the first region, and forming a pad overlapping with the second region.


Find Patent Forward Citations

Loading…