The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Oct. 30, 2020
Applicant:
Cytec Industries Inc., Princeton, NJ (US);
Inventors:
Yiqiang Zhao, Newark, DE (US);
Dalip Kohli, Churchville, MD (US);
Assignee:
CYTEC INDUSTRIES INC., Princeton, NJ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 65/00 (2006.01); C08G 59/50 (2006.01); C09J 5/02 (2006.01); C09J 7/50 (2018.01); C09J 163/00 (2006.01); B29C 65/48 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08G 59/50 (2013.01); C09J 5/02 (2013.01); C09J 7/50 (2018.01); B29C 65/483 (2013.01); B29C 65/485 (2013.01); C09J 2400/163 (2013.01); C09J 2400/166 (2013.01); C09J 2463/003 (2013.01);
Abstract
Disclosed herein is a solvent-based bonding primer composition containing one or more organic solvents, one or more epoxy resins, one or more curing agents, a silane compound, and a low amount of core-shell rubber particles in nanometer size, submicron or micron size. Also disclosed is a method of applying the solvent-based bonding primer composition onto a metallic surface of a first substrate prior to bonding the metallic surface to a second substrate via a curable adhesive.