The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Aug. 31, 2017
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventors:

Reiji Tsukao, Utsunomiya, JP;

Takeshi Miyake, Koyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08J 5/18 (2006.01); B32B 27/08 (2006.01); C09J 9/02 (2006.01); C09J 11/04 (2006.01); C09J 11/06 (2006.01); C09J 201/00 (2006.01); H01R 4/04 (2006.01); H01R 11/01 (2006.01);
U.S. Cl.
CPC ...
C08J 5/18 (2013.01); B32B 27/08 (2013.01); C09J 9/02 (2013.01); C09J 11/04 (2013.01); C09J 11/06 (2013.01); C09J 201/00 (2013.01); H01R 11/01 (2013.01); C08L 2203/16 (2013.01); H01R 4/04 (2013.01);
Abstract

In a filler-containing film in which fillers are dispersed in a resin layer, a flow of the fillers caused by an unnecessary flow of the resin layer is suppressed during the pressure bonding of the filler-containing film and an article. This filler-containing film (A) includes a filler-dispersed layer () in which fillers () are dispersed in a resin layer (). The surface in the vicinity of the fillers () of the resin layer () has concavities () and () with respect to the tangent plane to the central portion of the surface of the resin layer () between adjacent fillers (). The ratio (La/D) of a layer thickness La of the resin layer () to a particle diameter D of the filler () is preferably from 0.6 to 10.


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