The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 22, 2025
Filed:
Jun. 28, 2021
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Cheng-Yi Lin, Hukou Township, TW;
Shih-Ming Chen, Hsinchu, TW;
Assignee:
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01); C08G 59/14 (2006.01); C08J 5/18 (2006.01); C08L 33/04 (2006.01); C08L 63/00 (2006.01); G02F 1/1333 (2006.01); H10H 20/854 (2025.01); H10K 50/844 (2023.01);
U.S. Cl.
CPC ...
C08G 59/1477 (2013.01); C08J 5/18 (2013.01); C08L 33/04 (2013.01); C08L 63/00 (2013.01); C08J 2333/04 (2013.01); C08J 2363/00 (2013.01); C08J 2433/04 (2013.01); C08J 2463/00 (2013.01); C08L 2203/162 (2013.01); C08L 2203/206 (2013.01); G02F 1/133345 (2013.01); H01L 23/293 (2013.01); H10H 20/854 (2025.01); H10K 50/844 (2023.02);
Abstract
A resin composition is provided, which includes a first polymer and a second polymer. The first polymer is formed by a reaction of an epoxy resin modified with a first elastic molecular segment and an epoxy resin curing agent. The second polymer is formed by a polymerization of an acrylate modified with a second elastic molecular segment.